Liwei Electronic designs audio headphone and amplifier electronics on three solution platforms. Each platform is delivered as a complete package: chip selection, schematic and PCB layout, firmware integration, acoustic tuning and mass-production test support.
Amplifier PCBA Platform
Turnkey Bluetooth and USB audio amplifier boards built on Class-D amplification, with power management and interface control. Typical configurations cover 24 V DC designs driving 4-ohm loads, and portable battery-powered boards where efficiency and thermal behaviour drive the topology. View the amplifier PCBA solution.
Headphone PCBA Platform
Mainboard design for gaming, live-KTV and industrial hearing-protection headsets, including 2.4G plus Bluetooth dual-mode architectures, ENC call noise reduction and detachable-microphone interfaces. View the headphone PCBA solution.
2.4G Wireless Module Platform
Bluetooth and Wi-Fi SMT module design with antenna routing and RF performance tuning, covering module selection, 50-ohm impedance control, coexistence strategy and antenna matching. View the wireless module solution.
Engineering Collaboration
Every engagement starts from a requirement and cost review, then moves through schematic, layout, prototype and certification support. Contact our engineering team with your target specification and we will recommend a platform, an audio SoC and a realistic schedule.
Engineering support after design hand-off
Liwei keeps supporting the project once the design has been delivered: schematic and PCB layout review, 2.4 GHz and Bluetooth antenna matching and sensitivity optimisation, DSP and ANC tuning, test-station and calibration flow design, plus failure analysis and remediation during mass production. See Technical Support for the full scope and how we work.
From RFQ to Mass Production
Procurement teams usually need to know three things before they release a project: who owns the tooling, what the MOQ is, and how long qualification will take. Our answer is a single turnkey PCBA contract.
- Quotation input - send application, target functions, mechanical limits, compliance targets and annual volume. A costed BOM comes back with the chip options we can actually source.
- Sample stage - engineering samples are built in small quantities for evaluation and acoustic tuning.
- MOQ and lead time - quoted per project after the requirement review, since they depend on chip availability, tooling and test coverage rather than a fixed price list.
- Qualification - compliance pre-test, pilot run, then release to the eight fully automated SMT lines.
- After hand-off - firmware maintenance, second-source chip options and revision control for the life of the product.
Whether you need OEM build-to-print or ODM development from our reference designs, the engineering team stays on the project through mass-production introduction.
